Electrical Conductivity and Mechanical Properties of Dendritic Copper Particulate Polymer Films

Hybrid filler loaded multi-layer polymer composites are becoming one of the suitable alternative material for electromagnetic interference shielding (EMIS) applications. Mainly these composites are manufactured by conductive/magnetic fabrics, foams, foils or films or a combination of all, layered in an orderly architecture to obtain effective EMIS. In this work, dendrite structured copper particulate dispersed in cellulose acetate polymer (CA). We have developed approximately 100-micron thickness of cellulose acetate/copper filler (CA/Cu) films (7–55 wt%) and a neat CA film. The electrical conductivity, tensile strength, percentage of elongation, burst strength and folding endurance of CA/Cu films were measured and compared. The percolation threshold for conductivity was found at 28 wt% and the drastic increase in conductivity at 28–37 wt%. The mechanical strength of CA/Cu composite films was investigated and reported.