Strain Rate and Temperature-Dependent Deformation Behavior for Pb–10wt%Sn Solder Alloy

The mechanical response of Pb–10wt% Sn solder alloy has been tested under four strain rates and three deformation temperatures. The behavior of true stress–true strain of Pb–10wt% Sn solder alloy has been investigated over strain rates of 0.005–0.25% s−1 and deformation temperatures of 383, 413, and 433 K. The deformation behavior and grain growth mechanism were investigated by stress–strain curve analysis and microstructure observations. The results show that the general characteristics of stress–strain curve and microstructure of Pb–10wt% Sn alloy sensitively depend on the deformation temperature and strain rate. New free grains have been nucleated in microstructures in the process of dynamic recrystallization. These grains grow during deformation, forming coarser structure and elongation. The dynamic recrystallization and grain growth increase with increasing deformation temperature and decreasing strain rate.