Evolution of surface microstructure of Cu-50Cr alloy treated by high current pulsed electron beam

被引:0
作者
LinJiang Chai
ZhiMing Zhou
ZhiPei Xiao
Jian Tu
YaPing Wang
WeiJiu Huang
机构
[1] Chongqing University of Technology,College of Materials Science and Engineering
[2] Xi’an Jiaotong University,School of Science
来源
Science China Technological Sciences | 2015年 / 58卷
关键词
Cu-Cr alloy; microstructure; surface modification; electron beam;
D O I
暂无
中图分类号
学科分类号
摘要
A Cu-50Cr alloy was treated by the high current pulsed electron beam (HCPEB) at 20 and 30 keV with pulse numbers ranging from 1 to 100. Surface morphologies and microstructures of specimens before and after the treatments were investigated by employing scanning electron microscopy and X-ray diffraction. Results show that the HCPEB technique is able to induce remarkable surface modifications for the Cu-50Cr alloy. Cracks in Cr phases appear even after one-pulse treatment and their density always increases with the pulse number. Formation reason for these cracks is attributed to quasi-static thermal stresses accumulated along the specimen surface. Craters with typical morphologies are formed due to the dynamic thermal field induced by the HCPEB and they are found to prefer the sites near cracks or boundaries between neighboring Cr phases. Another microstructural characteristic produced by the HCPEB is the fine Cr spheroids, which are determined to be due to occurrence of liquid phase separation in the Cu-50Cr alloy. Finally, a general microstructural evolution profile that incorporates various HCPEB-induced surface features is tentatively outlined.
引用
收藏
页码:462 / 469
页数:7
相关论文
共 112 条
[1]  
Slade P G(1994)Advances in material development for high power, vacuum interrupter contacts IEEE Trans CPMT 17 96-106
[2]  
Rieder W F(1989)The influence of composition and Cr particle size of Cu/Cr contacts on chopping current, contact resistance, and breakdown voltage in vacuum interrupters IEEE Trans CPMT 12 273-283
[3]  
Schussek M(1999)The preparation and the properties of microcrystalline and nanocrystalline CuCr contact materials IEEE Trans CPMT 22 467-472
[4]  
Glatzle W(1996)Influence of microstructure on dielectric strength of CuCr contact materials in a vacuum IEEE Trans CPMT 19 76-81
[5]  
Wang Y P(1988)Rapid solidification and mechanical alloying techniques applied to Cu-Cr alloys Mater Sci Eng A 104 201-213
[6]  
Ding B J(2004)Microstructure and properties of vacuum induction melted CuCr25 alloys J Alloy Compd 366 289-292
[7]  
Ding B J(2005)Microstructure of rapidly solidified Cu-25wt.% Cr alloys Mater Sci Eng A 398 318-322
[8]  
Yang Z M(2007)Phase separation in undercooled Cu-Cr melts Mater Sci Eng A 449–451 654-657
[9]  
Wang X T(2006)Surface analytical chemical imaging and morphology of Cu-Cr alloy Surf Coat Technol 200 6373-6377
[10]  
Morris D G(2006)SIMS direct surface imaging of Cu Appl Surf Sci 252 2288-2296