Photoresist ashing technology using N2/O2 ferrite-core ICP in the dual damascene process

被引：0
作者：
Hyoun Woo Kim
Ju Hyun Myung
Jong Woo Lee
Hyung-Sun Kim
Keeho Kim
Jeong-Yeol Jang
Tae-Ho Yoon
Sung Kyeong Kim
Dae-Kyu Choi
Chin-Wook Chung
Geun Young Yeom
Jae-Min Myoung
Hyoung-June Kim
机构：
[1] Inha University,School of Materials Science and Engineering
[2] Dongbu-Anam Semiconductor Co. Inc.,Division of Electrical & Computing Engineering
[3] New Power Plasma Co. Ltd.,Department of Materials Engineering
[4] Hanyang University,Department of Materials Science and Engineering
[5] Sungkyunkwan University,Department of Materials Science and Engineering
[6] Yonsei University,undefined
[7] Hongik University,undefined
来源：
Journal of Materials Science | 2006年 / 41卷
关键词：
Dual Damascene; Damascene Process; Dual Damascene Process; Blanket Wafer; Trench Hole;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：5040 / 5042
页数：2
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