The tensile and compressive deformation mechanisms of the Cu/Al2Cu/Al-layered composites via molecular dynamics simulation

To investigate the compression and deformation behavior of nano-polycrystalline Cu/Al2Cu/Al-layered composites, it was constructed and analyzed using molecular dynamics simulation (MD). The findings indicate that The Cu/Al2Cu/Al materials exhibit sensitivity to changes in the interfacial layer d due to the asymmetry between tensile and compressive deformations. The compressive strain strengthening of the nano-polycrystalline Cu/Al2Cu/Al-layered composites increases as the interfacial layer d increases. During the tensile process, an increase in interfacial layer d leads to an increase in Young's modulus, while the fracture strength and fracture strain first increase and then decrease. The interfacial layer with a value of d = 4.88 nm promotes the delocalization of strain during the tensile and compressive deformation of nano-polycrystalline Cu/Al2Cu/Al materials. It facilitates cooperative deformation behavior between components, leading to improved toughness and strength of the materials.