Manufacturing of 3D multifunctional microelectronic devices: challenges and opportunities

被引：0
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作者：
Xiaogang Guo
Zhaoguo Xue
Yihui Zhang
机构：
[1] Tsinghua University,AML, Department of Engineering Mechanics; Center for Flexible Electronics Technology
来源：
NPG Asia Materials | 2019年 / 11卷
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摘要：
This perspective highlights various representative manufacturing methods of 3D microelectronic devices and their specific features/limitations. It offers an outlook on future developments in the manufacturing of 3D multifunctional microelectronics devices, and provides some perspectives on the remaining challenges as well as possible solutions. Mechanically guided 3D assembly based on compressive buckling is proposed as a versatile platform that can be merged with micromanufacturing technologies and/or other assembly methods to provide access to microelectronic devices with more types of integrated functions and highly increased densities of functional components.
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