Deformation behavior of tin and some tin alloys

被引：0
|
作者：
Fuqian Yang
J. C. M. Li
机构：
[1] University of Kentucky,Department of Chemical and Materials Engineering
[2] University of Rochester,Department of Mechanical Engineering
来源：
Journal of Materials Science: Materials in Electronics | 2007年 / 18卷
关键词：
Slip System; Creep Rate; Creep Deformation; Stress Exponent; Solder Ball;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Plastic deformation, creep and deformation twinning of β-tin and some tin alloys related to Pb-free solder applications are reviewed. The results are summarized and evaluated among conflicting findings and conclusions. The studies are helpful for the search of the best Pb-free solder with reliability and long service life. The areas which need more information are pointed out.
引用
收藏
页码：191 / 210
页数：19
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