Partially Absorbable 3D Printed Innovative Orthopedic Implants

被引:0
作者
Rupinder Singh
Abhishek Barwar
Abhishek Kumar
机构
[1] National Institute of Technical Teachers Training and Research,Department of Mechanical Engineering
来源
National Academy Science Letters | 2022年 / 45卷
关键词
Simulated body fluid; Vector network analyzer; Dielectric constant; Loss tangent;
D O I
暂无
中图分类号
学科分类号
摘要
Commercially the orthopedic implants (OI) of metals/alloys/polymers are being widely used in clinical applications. But hitherto little has been reported on partially absorbable OI for supporting osteointegration and online health monitoring. This study outlines the 3D printed partially absorbable innovative OI comprising of 17-4 precipitate hardened stainless steel (as conductor and ground plane) and polylactic acid-based composite with the reinforcement of hydroxyapatite, and chitosan (as dielectric material). The 3D printed innovative OI of multi-materials was explored for online sensing capabilities based upon dielectric constant (εr) and loss tangent (tanδ) of dielectric material. The radio frequency and polarization resistance (Rp) analysis under the effect of simulated body fluid was conducted to ascertain the health of innovative OI in the industrial, scientific, and medical band as an internet of things-based solution.
引用
收藏
页码:417 / 421
页数:4
相关论文
共 50 条
  • [21] Fabrication of 3D-Printed Polyurethane Resin Composites and its Dielectric Performance
    Ghule, Babaji
    Laad, Meena
    Sadasivuni, Kishor Kumar
    Maurya, Muni Raj
    Cabibihan, John-John
    [J]. CHEMISTRY AFRICA-A JOURNAL OF THE TUNISIAN CHEMICAL SOCIETY, 2024, 7 (02): : 823 - 833
  • [22] 3-D-Printed Wideband Multi-Ring Dielectric Resonator Antenna
    Xia, Zhen-Xing
    Leung, Kwok Wa
    Lu, Kai
    [J]. IEEE ANTENNAS AND WIRELESS PROPAGATION LETTERS, 2019, 18 (10): : 2110 - 2114
  • [23] Fabrication of 3D-Printed Polyurethane Resin Composites and its Dielectric Performance
    Babaji Ghule
    Meena Laad
    Kishor Kumar Sadasivuni
    Muni Raj Maurya
    John-John Cabibihan
    [J]. Chemistry Africa, 2024, 7 : 823 - 833
  • [24] Characterization of 3D-Printed Dielectric Substrates with Different Infill for Microwave Applications
    Massoni, Enrico
    Silvestri, Lorenzo
    Bozzi, Maurizio
    Perregrini, Luca
    Alaimo, Gianluca
    Marconi, Stefania
    Auricchio, Ferdinando
    [J]. 2016 IEEE MTT-S INTERNATIONAL MICROWAVE WORKSHOP SERIES ON ADVANCED MATERIALS AND PROCESSES FOR RF AND THZ APPLICATIONS (IMWS-AMP), 2016,
  • [25] Clinical Microwave Breast Imaging-2D Results and the Evolution to 3D
    Meaney, P. M.
    Fanning, M. W.
    Zhou, T.
    Golnabi, A.
    Geimer, S. D.
    Paulsen, K. D.
    [J]. ICEAA: 2009 INTERNATIONAL CONFERENCE ON ELECTROMAGNETICS IN ADVANCED APPLICATIONS, VOLS 1 AND 2, 2009, : 881 - 884
  • [26] Optimization of Performance and Reliability in 3D NAND Flash Memory
    Ouyang, Yingjie
    Xia, Zhiliang
    Yang, Tao
    Shi, Dandan
    Zhou, Wenxi
    Huo, Zongliang
    [J]. IEEE ELECTRON DEVICE LETTERS, 2020, 41 (06) : 840 - 843
  • [27] Influence of SiC Doping on the Mechanical, Electrical, and Optical Properties of 3D-Printed PLA
    Skorda, Stefania
    Bardakas, Achilleas
    Segkos, Apostolos
    Chouchoumi, Nikoleta
    Hourdakis, Emmanouel
    Vekinis, George
    Tsamis, Christos
    [J]. JOURNAL OF COMPOSITES SCIENCE, 2024, 8 (03):
  • [28] Thermoelectric transport properties in 3D Dirac semimetal Cd3As2
    Amarnath, R.
    Bhargavi, K. S.
    Kubakaddi, S. S.
    [J]. JOURNAL OF PHYSICS-CONDENSED MATTER, 2020, 32 (22)
  • [29] Thermal Scaffolding for Ultra-Dense 3D Integrated Circuits
    Rich, Dennis
    Kasperovich, Anna
    Malakoutian, Mohamadali
    Radway, Robert M.
    Hagiwara, Shiho
    Yoshikawa, Takahide
    Chowdhury, Srabanti
    Mitra, Subhasish
    [J]. 2023 60TH ACM/IEEE DESIGN AUTOMATION CONFERENCE, DAC, 2023,
  • [30] On the Tertiary Recycling of PVDF Composite Matrix by 3D Dispenser Printing
    Mehta, Ankush
    Singh, Rupinder
    Pabla, B.S.
    Kumar, Ranvijay
    [J]. Journal of The Institution of Engineers (India): Series C, 2024, 105 (05) : 1359 - 1366