Silicone Resin-Based Composite Materials for High Thermal Stability and Thermal Conductivity

被引:0
作者
Yi Liu
Zhenxing Chen
Yishen Qin
Yuqiu Shen
Yong Zhou
Dan Wang
Jiaxin Hu
Wenchao Feng
机构
[1] Sun Yat-sen University,School of Chemical Engineering and Technology
[2] Baise University,School of Materials Science and Engineering
[3] The Key Laboratory of Low-Carbon Chemistry and Energy Conservation of Guangdong Province,undefined
来源
Journal of Electronic Materials | 2020年 / 49卷
关键词
Silicone resin; composites; thermal stability; thermal conductivity;
D O I
暂无
中图分类号
学科分类号
摘要
Insulated silicone/alumina (Al2O3) composites with high thermal stability and thermal conductivity were fabricated, in which the silicone resin was fabricated by a hydrolysis and condensation reaction with triethoxysilane (MTES), dimethyldiethoxysilane (DMDES) and phenyltrimethoxysilane (PhTMS). When the Al2O3 loading was 80 wt.%, the composite had only a 1.2% weight loss at 390°C. When the volume ratio of the 10 μm Al2O3 powder to 0.5 μm Al2O3 powder was controlled at 7:3, the silicone resin-based composite had thermal conductivity of 1.18 W m−1 K−1, which is 6.2 times as high as that of the pure silicone resin. Furthermore, the silicone/Al2O3 composite had dielectric strength of 87.5 kV mm−1.
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页码:4379 / 4384
页数:5
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