Intermetallic formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with immersion Ag surface finish

被引：0
作者：
Tung-Han Chuang
Shiu-Fang Yen
Hui-Min Wu
机构：
[1] National Taiwan University,Institute of Materials Science and Engineering
来源：
Journal of Electronic Materials | 2006年 / 35卷
关键词：
Sn3Ag0.5Cu; Sn3Ag0.5Cu0.06Ni0.01Ge; immersion Ag surface finish; intermetallic compounds;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
The intermetallic compounds formed in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Ag/Cu pads are investigated. After reflow, scallop-shaped η-Cu6Sn5 and continuous planar η-(cu0.9Ni0.1)6Sn5 intermetallics appear at the interfaces of the Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder joints, respectively. In the case of the Sn3Ag0.5Cu specimens, an additional ε-Cu3Sn intermetallic layer is formed at the interface between the η-Cu6Sn5 and Cu pads after aging at 150°C, while the same type of intermetallic formation is inhibited in the Sn3Ag0.5Cu0.06Ni0.01Ge packages. In addition, the coarsening of Ag3Sn precipitates also abates in the solder matrix of the Sn3Ag0.5Cu0.06Ni0.01Ge packages, which results in a slightly higher ball shear strength for the specimens.
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页码：310 / 318
页数：8
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