Overview of fatigue performance of Cu processed by severe plastic deformation

被引:0
作者
S. R. Agnew
A. Yu. Vinogradov
S. Hashimoto
J. R. Weertman
机构
[1] Northwestern University,
[2] Kanazawa University,undefined
[3] Kyoto University,undefined
[4] Oak Ridge National Laboratory,undefined
[5] Osaka City University,undefined
来源
Journal of Electronic Materials | 1999年 / 28卷
关键词
Fatigue; copper; ultrafine grain; cyclic softening; shear bands; persistent slip bands; severe plastic deformation;
D O I
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中图分类号
学科分类号
摘要
This study investigates discrepancies regarding cyclic softening of Cu processed by severe plastic deformation (SPD). All samples softened if the microhardnesses before and after fatiguing are compared. However, the effect decreases if the strain amplitude is small, Δεp <1 × 10−3). Samples with equiaxed subgrains were more resistant to softening and thermal recovery. All samples had “persistent” shear bands except those tested at the highest amplitudes, Δεp >1 × 10−2. Cu processed by SPD exhibits an enhanced fatigue life at low amplitudes. However, low thermal stability, potential for softening, and poor low-cycle properties discredit this advantage.
引用
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页码:1038 / 1044
页数:6
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