Electromechanical impedance (EMI) technique as alternative to monitor workpiece surface damages after the grinding operation

被引:0
作者
Rosemar Batista da Silva
Fabio Isaac Ferreira
Fabrício Guimares Baptista
Paulo Roberto de Aguiar
Rodrigo de Souza Ruzzi
Henrique Butzlaff Hubner
Maria da Penha Cindra Fonseca
Eduardo Carlos Bianchi
机构
[1] Federal University of Uberlandia (UFU),School of Mechanical Engineering
[2] São Paulo State University (UNESP),Department of Electrical Engineering, Faculty of Engineering Bauru (FEB)
[3] Federal University Fluminense (UFF),School of Mechanical
[4] São Paulo State University (UNESP),Department of Mechanical Engineering, Faculty of Engineering Bauru (FEB)
来源
The International Journal of Advanced Manufacturing Technology | 2018年 / 98卷
关键词
Grinding; Surface integrity; Non-destructive technique; Electromechanical impedance; Microhardness; Surface roughness; Grinding power; Piezoelectric transducers;
D O I
暂无
中图分类号
学科分类号
摘要
Electromechanical impedance (EMI) technique has been employed in detection of structural failure in civil and mechanical structures because of its non-destructive property and easy implementation of small and inexpensive piezoelectric transducers that are attached to the structures, which lead to cost reduction as well as lesser dependence of manual inspection methods. In this technique, the capsule is excited by applying a sinusoidal voltage to generate waves to propagate throughout the structure. From the impedance signature of the structure without any damage, any structural change can be detected by measuring the electrical impedance of the piezoelectric (PZT) patch. Based on its real potentiality and because of its non-destructive characteristics, this work aimed to employ the EMI technique as the first alternative to monitor workpiece surface damages after grinding operation with a conventional abrasive grinding wheel. EMI measurements were performed by using a low-cost PZT transducer and under controlled environmental conditions. Microhardness and surface roughness of the machined surfaces, as well as grinding power, were also measured to detect any damage in the machined surface and to stablish relationship with the EMI technique. From the damage indices root mean square deviation (RMSD) and correlation coefficient deviation metric (CCDM), surface alterations on the ground surfaces were inferred by the EMI method. Also, it was observed a good correlation between the EMI technique and the other output parameters that were investigated in this work, such as surface roughness and power grinding, thereby posing as a non-destructive, low-cost, and viable technique to monitor workpiece surface damages in the grinding operation.
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收藏
页码:2429 / 2438
页数:9
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