Effect of water on the electrodeposition of copper from a deep eutectic solvent

被引：0
|
作者：
P. E. Valverde
T. A. Green
S. Roy
机构：
[1] University of Strathclyde,Department of Chemical and Process Engineering
来源：
Journal of Applied Electrochemistry | 2020年 / 50卷
关键词：
Electrodeposition; Copper; Kinetics; Deep eutectic solvent;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
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页码：699 / 712
页数：13
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