Solvent-free fabrication of thermally conductive insulating epoxy composites with boron nitride nanoplatelets as fillers

被引：0
|
作者：
Zifeng Wang
Yuqiao Fu
Wenjun Meng
Chunyi Zhi
机构：
[1] City University of Hong Kong,Department of Physics and Materials Science
[2] City University of Hong Kong,Shenzhen Research Institute
来源：
Nanoscale Research Letters | / 9卷
关键词：
Boron nitride nanoplatelets; Thermal conductivity; Epoxy composites; Solvent-free fabrication;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
A solvent-free method for the fabrication of thermally conductive epoxy-boron nitride (BN) nanoplatelet composite material is developed in this study. By this method, polymer composites with nearly any filler fractions can be easily fabricated. The maximum thermal conductivity reaches 5.24 W/mK, which is 1,600% improvement in comparison with that of pristine epoxy material. In addition, the as-fabricated samples exhibit excellent overall performances with great mechanical property and thermal stability well preserved.
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