Aspects of the structural evolution of lead-free solder joints

被引：1
|
作者：
A. Zribi
R. Kinyanjui
P. Borgesen
L. Zavalij
E. J. Cotts
机构：
[1] State University of New York,Physics Department and Materials Science Program
[2] Universal Instruments Corporation in Kirkwood,Physics Department
[3] State University of New York,undefined
来源：
JOM | 2002年 / 54卷
关键词：
Solder Joint; Diffusion Couple; Solder Alloy; Solder Matrix; SnAgCu Solder;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Studies of the formation of intermetallic compounds at some lead-free solder/metallization interfaces are briefly reviewed in this article. SnAgCu/Ni and SnAgCu/Cu interfaces are examined in particular. It has been found that (Cu,Ni)6Sn5 forms at SnAgCu/Ni interfaces until copper is depleted from the solder matrix. This article also contrasts the formation of (Au,Ni)Sn4 and related compounds in PbSn/Ni solder joints and lead-free solder joints.
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收藏
页码：38 / 40
页数：2
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