Creep in multi-component materials systems

被引:0
|
作者
Indranath Dutta
机构
[1] the Department of Mechanical Engineering,the Composites, Thin Films, and Interfaces Laboratory
[2] the Center for Materials Science and Engineering of the Naval Postgraduate School,undefined
来源
JOM | 2003年 / 55卷
关键词
Homologous Temperature; Naval Postgraduate School; Superalloy Substrate; High Homologous Temperature; High Interfacial Area;
D O I
暂无
中图分类号
学科分类号
摘要
引用
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页码:14 / 14
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