Diffusion Bonding of TiAl to Ti6Al4V Using Nanolayers

Microstructural characterization of TiAl to Ti6Al4V dissimilar diffusion bonds assisted by reactive Ni/Al nanolayers was performed in this study. The nanolayers (alternated Al and Ni) were deposited onto the base material surfaces. Diffusion bonding was performed at 700 and 800 °C under pressures from 5 to 40 MPa and dwell times between 60 and 180 min. Microstructural characterization was performed using high-resolution transmission and scanning electron microscopies. The observations revealed that dissimilar TiAl to Ti6Al4V joints assisted by Ni/Al reactive nanolayers can be obtained successfully at 800 °C during 60 min using a pressure of 20 MPa. The bond interface is thin (less than 10 µm) and is mainly composed of NiAl grains. Thin layers of Al-Ni-Ti intermetallic compounds were formed adjacent to the base materials.