Electroless Nickel Plating – A Review

被引:0
|
作者
C. A. Loto
机构
[1] Covenant University,Department of Mechanical Engineering
[2] Tshwane University of Technology,Department of Chemical, Metallurgical and Materials Engineering
来源
Silicon | 2016年 / 8卷
关键词
Electroless; Nickel; Plating; Solutions; Baths; Process parameters;
D O I
暂无
中图分类号
学科分类号
摘要
The operating process, versatility and the increasing research interest in optimising the process and products technology in the electroless plating method of metal coating, particularly, the electroless nickel plating of metallic substrates such as mild steel, necessitates the writing of this review. It is also aimed at providing more literature information, both of the past and the present published research in this field. In this paper, electroless nickel plating is introduced. The various nickel plating solutions and baths’ operating parameters; main types of electroless nickel plating; the mechanism involved in the plating process; application of the nickel plating process to iron powders; advantages and disadvantages and the process’s other applications are reviewed. Electroless nickel plating produces an amorphous deposit in the as-plated condition. The deposit is not dependent on current distribution and hence it is almost uniform in thickness. Electroless nickel plating is far more difficult to remove chemically than conventional nickel deposits due to its superior corrosion resistance. The deposit has a good wettability and is generally hard. However, its bath control is more complex than with electroplating. The bath also has lower efficiency and higher operating costs, even without the use of electricity.
引用
收藏
页码:177 / 186
页数:9
相关论文
共 50 条
  • [1] Electroless Nickel Plating - A Review
    Loto, C. A.
    SILICON, 2016, 8 (02) : 177 - 186
  • [2] Nickel electroless plating: a review
    Ben Amor, Y.
    Frateur, I.
    Mat, P.
    Boualam, M.
    MATERIAUX & TECHNIQUES, 2014, 102 (01):
  • [3] ELECTROLESS NICKEL PLATING - A REVIEW.
    Spencer, Lester F.
    Metal Finishing, 1975, 73 (01) : 38 - 44
  • [4] ELECTROLESS NICKEL PLATING ON SILICON
    IWASA, H
    YOKOZAWA, M
    TERAMOTO, I
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1968, 115 (05) : 485 - &
  • [5] CHEMICAL (ELECTROLESS) NICKEL PLATING
    ALBERTH, W
    GALVANOTECHNIK, 1979, 70 (06): : 502 - 505
  • [6] Electroless nickel plating of diamond
    Tong, Kui
    Xu, Enxia
    Xin, Rongsheng
    Pan, Yuehong
    Cailiao Baohu/Materials Protection, 2000, 33 (02): : 19 - 20
  • [7] ELECTROLESS NICKEL PLATING ON TITANIUM
    GRAHAM, GH
    PLATING AND SURFACE FINISHING, 1983, 70 (11): : 46 - 46
  • [8] Electroless nickel plating of magnesium
    Fairweather, WA
    TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING, 1997, 75 : 113 - 117
  • [9] TRENDS IN ELECTROLESS NICKEL PLATING
    COLARUOTOLO, JF
    PLATING AND SURFACE FINISHING, 1985, 72 (12): : 22 - 25
  • [10] ELECTROLESS PLATING OF NICKEL ON SILICON
    ARNOLD, AF
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1972, 119 (08) : C233 - &