Micromechanical characterization of electroplated permalloy films for MEMS

被引：0

作者：

Xueping Li

Guifu Ding

Taeko Ando

Mitsuhiro Shikida

Kazuo Sato

机构：

[1] Shanghai Jiao Tong University,Key Laboratory for Thin Film and Microfabrication Technology of Ministry of Education, Institute of Micro/Nano Science and Technology

[2] Nagoya University,Department of Micro

来源：

Microsystem Technologies | 2008年 / 14卷

关键词：

Tensile Force; Gauge Section; Fracture Strain; Micro Electro Mechanical System; Soft Magnetic Material;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

In order to improve the reliability of MEMS designs, evaluating the mechanical properties of soft magnetic materials is needed. In this paper, we present a tensile testing method to characterize the mechanical properties of microscale electroplated permalloy (80 wt% Ni, 20 wt% Fe) films. The gauge section of the specimen is 50 μm wide, 100 μm long and 5 μm thick. The measured Young’s modulus of permalloy films is 96.4 GPa, and the tensile strength is 1.61 GPa. The fracture strain measured by the images of specimens is about 2%.

引用

页码：131 / 134

页数：3