Reliability of composite solder bumps produced by an in-situ process

被引：0
|
作者：
Jong-Hyun Lee
Daejin Park
Jong-Tae Moon
Yong-Ho Lee
Dong Hyuk Shin
Yong-Seog Kim
机构：
[1] Hong Ik University,Department of Metallurgy and Materials Science
[2] Hyundai Electronics Ind.,Device and Semiconductor Res. Div.
[3] Hanyang University,Department of Metallurgy and Materials Science
来源：
Journal of Electronic Materials | 2000年 / 29卷
关键词：
In-situ composite; Cu; Sn; dispersoid; thermal stability; reaction rate; shear strength;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
In an attempt to develop a thermally stable solder system, an in-situ Pb-Sn solder composite reinforced with Cu6Sn5 dispersoids was investigated for its thermal stability. The stability was evaluated mainly by measuring the growth rate of intermetallics at in-situ composite solder/BLM interface as a function of the number of reflow soldering cycles and aging time. The rates were compared with those of the eutectic Pb-Sn and Sn-Ag solders. After the thermal treatments, the solder joints were tested for their shear strengths. The results indicated that the in-situ composite solder has a higher shear strength and better thermal stability than the eutectic Pb-Sn solder.
引用
收藏
页码：1264 / 1269
页数：5
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