Effects of Concentration of Adipic Acid on the Electrochemical Migration of Tin for Printed Circuit Board Assembly

被引：0
作者：
Yi Sing Goh
A. S. M. A. Haseeb
Wan Jeffrey Basirun
Yew Hoong Wong
Mohd Faizul Mohd Sabri
Boon Yew Low
机构：
[1] Universiti Malaya,Department of Mechanical Engineering, Faculty of Engineering
[2] Universiti Malaya,Centre of Advanced Materials, Faculty of Engineering
[3] Bangladesh University of Engineering and Technology,Department of Nanomaterials and Ceramic Engineering, Faculty of Chemical and Materials Engineering
[4] Universiti Malaya,Department of Chemistry, Faculty of Science
[5] Universiti Malaya,Nanotechnology and Catalysis Research Centre, Institute for Advanced Studies
[6] Universiti Malaya,Centre for Energy Sciences, Faculty of Engineering
[7] NXP Malaysia Sdn Bhd,undefined
来源：
Journal of Electronic Materials | 2023年 / 52卷
关键词：
ECM; dendrite; flux residue; corrosion; water drop test; electrochemical parameters;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
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收藏
页码：2236 / 2249
页数：13
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