Preparation of Three-Dimensional Carbon Network Reinforced Epoxy Composites and Their Thermal Conductivity

As a thermosetting resin with excellent properties, epoxy resin is used in many areas such as electronics, transportation, aerospace, and other fields. However, its relatively low thermal conductivity limits its wide application in more demanding fields. Here, a three-dimensional carbon (3DC) network was prepared through NaCl template-assisted in situ chemical vapor deposition (CVD) and used to reinforce epoxy resin for enhancing its thermal conductivity. The 3DC was prepared with a molar ratio of sodium atom to carbon atom of 100:20, and argon atmosphere in CVD led to an optimal improvement in the thermal conductivity of epoxy resin. The thermal conductivity of epoxy resin increased by 18% when the filling content was 3 wt.% of 3DC network because of the high contact area, uniform dispersion, and enhanced formation of conductive paths with epoxy resin. As the amount of 3DC addition increases, the thermal conductivity of composites also increases. As an innovative exploration, the work presented in this paper is of great significance for the thermal conductivity application of epoxy resin in the future.