Stress analysis of weldments by holographic moiré and the finite element method

被引：0
|
作者：
C. A. Sciammarella
B. Singh
B. Trentadue
F. M. Sciammarella
机构：
[1] Illinois Institute of Technology,Mechanical, Materials & Aerospace Engineering Department
[2] Case Corporation,Politecnico di Bari
[3] Dipartimento de Progettazione e Produzione Industriale,Mechanical, Materials & Aerospace Engineering Department
[4] Illinois Institute of Technology,undefined
来源：
Experimental Mechanics | 2000年 / 40卷
关键词：
Electronic holography; experimental mechanics analysis of weldments; finite elements;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
The research work presented in this paper deals with the determination of the stress concentration at the root of the fillet of a weldment on a T steel specimen. A finite element model was developed for the specimen. Measurements were carried out using the holographic moiré technique. Strain gages were added to evaluate extrapolation techniques proposed in the literature. Good agreement was found between the finite element results and the optically measured values. The strain gage extrapolation technique yielded very low values.
引用
收藏
页码：15 / 21
页数：6
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