Hot-pressed AlN-Cu metal matrix composites and their thermal properties

被引:0
作者
J. Tian
K. Shobu
机构
[1] National Institute of Advanced Industrial Science and Technology (AIST),
[2] Kyushu Center,undefined
来源
Journal of Materials Science | 2004年 / 39卷
关键词
Nitrogen; Polymer; Thermal Conductivity; Liquid Phase; Thermal Expansion;
D O I
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中图分类号
学科分类号
摘要
AlN-Cu metal matrix composites containing AlN volume fractions between 0.1 and 0.5 were fabricated firstly by liquid phase sintering of AlN using Y2O3 as a sintering aid and then by hot pressing the powder mixtures of sintered AlN and Cu at 1050°C with a pressure of 40 MPa under flowing nitrogen. With Y2O3 additions of 1.5 to 10 wt%, the densification of AlN could be achieved by liquid phase sintering at 1900°C for 3 h and subsequently slow cooling. The sintered AlN showed a maximum thermal conductivity of 166 W/m/K at a Y2O3 level of 6 wt%. Dense AlN-Cu composites with AlN contents up to 40 vol% were achieved by hot pressing. The thermal conductivity and the coefficient of the thermal expansion (CTE) of the composites decreased with increasing AlN volume fractions, giving typical values of 235 W/m/K and 12.6 × 10−6/K at an AlN content of 40 vol%.
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页码:1309 / 1313
页数:4
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