Whole-field strain measurement in a pin-loaded plate by electronic speckle pattern interferometry and the finite element method

被引:0
|
作者
F. Lanza di Scalea
S. S. Hong
G. L. Cloud
机构
[1] Michigan State University,Department of Materials Science and Mechanics
来源
Experimental Mechanics | 1998年 / 38卷
关键词
Finite Element Method; Digital Image Processing; Image Processing Algorithm; Strain Concentration; Contact Analysis;
D O I
暂无
中图分类号
学科分类号
摘要
The strain field in an epoxy plate loaded in tension through a steel pin is determined using electronic speckle pattern interferometry (ESPI) and the finite element method (FEM). In a dual-beam illumination speckle interferometer, the in-plane component of the displacement at the plate's surface is accurately measured using a four-step phase-shifting algorithm. Digital image processing algorithms have been developed for noise reduction and strain calculation directly in the computer from the phase map with a strain gage length of about 0.4 mm. A whole-field strain map is obtained, as well as distributions of strain concentration factor, in critical regions near the hole of the plate. FEM is used to perform a nonlinear contact analysis accounting for friction effects at the pin/hole interface. The agreement between experimental results and numerical predictions is good. In terms of speed, accuracy and ease of use, dual-beam ESPI appears to be a superior method of whole-field strain analysis.
引用
收藏
页码:55 / 60
页数:5
相关论文
共 50 条
  • [21] ELECTRONIC SPECKLE PATTERN INTERFEROMETRY AND FINITE-ELEMENT MODELING FOR THE ANALYSIS OF VERY SMALL VIBRATING OBJECTS
    WYCKAERT, K
    MAGITS, H
    SAS, P
    MECHANICAL SYSTEMS AND SIGNAL PROCESSING, 1990, 4 (03) : 243 - 256
  • [22] Electronic speckle pattern interferometry with a microstructured refractive optical element and compact interferometer based on this method
    Petrov, Valery
    Lau, Bernhard
    Optik (Jena), 2000, 111 (12): : 529 - 535
  • [23] Electronic speckle pattern interferometry with a microstructured refractive optical element and compact interferometer based on this method
    Petrov, V
    Lau, B
    OPTIK, 2000, 111 (12): : 529 - 535
  • [24] Full-field measurement of deformation of recycled paper using electronic speckle pattern interferometry
    Umezaki, E
    Takakuwa, J
    ADVANCES IN NONDESTRUCTIVE EVALUATION, PT 1-3, 2004, 270-273 : 686 - 689
  • [25] Evaluation of the continuous wavelet transform method for the phase measurement of electronic speckle pattern interferometry fringes
    Federico, A
    Kaufmann, GH
    OPTICAL ENGINEERING, 2002, 41 (12) : 3209 - 3216
  • [26] Shape measurement by endoscopic electronic-speckle-pattern interferometry with a two-wavelength method
    Kemper, B
    Kandulla, J
    Knoche, S
    von Bally, G
    SPECKLE METROLOGY 2003, PROCEEDINGS, 2003, 4933 : 129 - 134
  • [27] Electronic speckle pattern interferometry of residual stress measurement using hole-indentation method
    Sim, CN
    Tay, CJ
    Cheng, L
    Third International Conference on Experimental Mechanics and Third Conference of the Asian-Committee-on-Experimental-Mechanics, Pts 1and 2, 2005, 5852 : 938 - 944
  • [28] A study on the measurement of in-plane displacement at high temperature by electronic speckle pattern interferometry method
    Kim, KS
    Kim, HT
    Cha, YH
    Jung, HC
    Jarng, SS
    Kim, JY
    Yang, SP
    REVIEW OF PROGRESS IN QUANTITATIVE NONDESTRUCTIVE EVALUATION, VOLS 17A AND 17B, 1998, : 1801 - 1808
  • [29] A computational method for determining tissue material properties in ovine fracture calluses using electronic speckle pattern interferometry and finite element analysis
    Steiner, Malte
    Claes, Lutz
    Simon, Ulrich
    Ignatius, Anita
    Wehner, Tim
    MEDICAL ENGINEERING & PHYSICS, 2012, 34 (10) : 1521 - 1525
  • [30] Full field and microregion deformation measurement of thin films using electronic speckle pattern interferometry and array microindentation marker method
    Li, XD
    Wei, C
    Yang, Y
    OPTICS AND LASERS IN ENGINEERING, 2005, 43 (08) : 869 - 884