Tunable electrodeposition of Sn and Sn-based alloys using ionic liquids

The electrochemical behavior of Sn(II) was studied at 25 °C in three different room temperature ionic liquids (1-ethyl-3-methylimidazolium dicyanamide (EMI-DCA), 1-butyl-1-methylpyrrolidium bis-(trifluoromethanesulfonyl)imide (BMP-NTf2), 1-ethyl-3-methylimidazolium bis-(trifluoromethanesulfonyl)imide (EMI-NTf2)). The Sn(II) was introduced into EMI-NTf2 by anodic dissolution with a current efficiency of almost 100 %. The diffusion coefficient of Sn(II) was compared in three ionic liquids at different temperatures. In addition, the morphology of Sn deposits on the inert substrate Mo obtained from three ionic liquids at 25 °C was characterized. This study also shows that the copper–tin alloy could be achieved in EMI-NTf2 by the electrodeposition method and subsequent thermal treatment.