Studies of the Thermal Conductivity and Thermal Resistance of Solder Layers with Lead-Free Pastes by the Photodeflection Method

被引:0
作者
A. L. Glazov
V. S. Kalinovskii
E. V. Kontrosh
K. L. Muratikov
机构
[1] Ioffe Institute,
来源
Technical Physics Letters | 2023年 / 49卷
关键词
thermal resistance; multi-junction solar cells; lead-free solder; non-destructive testing; thermal waves;
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学科分类号
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页码:265 / 268
页数:3
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