Non-reactive versus dissolutive wetting of Ag–Cu alloys on Cu substrates

被引:0
作者
O. Kozlova
R. Voytovych
P. Protsenko
N. Eustathopoulos
机构
[1] SIMaP/PHELMA,Department of Colloid Chemistry
[2] INPG,undefined
[3] D.U.,undefined
[4] MSU,undefined
来源
Journal of Materials Science | 2010年 / 45卷
关键词
Contact Angle; Liquid Film; Spreading Rate; Triple Line; Equilibrium Contact Angle;
D O I
暂无
中图分类号
学科分类号
摘要
The fundamental issues of equilibrium and non-equilibrium (dissolutive) wetting and spreading in the liquid Ag/solid Cu system are studied by the dispensed drop technique. To this end, wetting experiments of Cu, both mono- and poly-crystalline, with two types of Ag–Cu alloys, one non-saturated and the other saturated in copper, are performed at 900 °C in high vacuum by the dispensed drop technique. The results are compared with those given in the literature for the same or similar systems as well as with model predictions.
引用
收藏
页码:2099 / 2105
页数:6
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