Non-reactive versus dissolutive wetting of Ag–Cu alloys on Cu substrates

被引：0
作者：
O. Kozlova
R. Voytovych
P. Protsenko
N. Eustathopoulos
机构：
[1] SIMaP/PHELMA,Department of Colloid Chemistry
[2] INPG,undefined
[3] D.U.,undefined
[4] MSU,undefined
来源：
Journal of Materials Science | 2010年 / 45卷
关键词：
Contact Angle; Liquid Film; Spreading Rate; Triple Line; Equilibrium Contact Angle;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
The fundamental issues of equilibrium and non-equilibrium (dissolutive) wetting and spreading in the liquid Ag/solid Cu system are studied by the dispensed drop technique. To this end, wetting experiments of Cu, both mono- and poly-crystalline, with two types of Ag–Cu alloys, one non-saturated and the other saturated in copper, are performed at 900 °C in high vacuum by the dispensed drop technique. The results are compared with those given in the literature for the same or similar systems as well as with model predictions.
引用
收藏
页码：2099 / 2105
页数：6
相关论文
共 50 条
[31]   Hysteresis phenomenon and wetting characteristics of molten Sn-3.0 wt.%Ag-0.5 wt.%Cu on different tilting substrates [J].
Xu, Hongyan ;
Yuan, Zhangfu ;
Matsuura, Hiroyuki ;
Tsukihashi, Fumitaka .
JOURNAL OF ALLOYS AND COMPOUNDS, 2009, 487 (1-2) :121-125
[32]   Wetting process and interfacial characteristic of Sn-3.0Ag-0.5Cu on different substrates at temperatures ranging from 503 K to 673 K [J].
Zang, Likun ;
Yuan, Zhangfu ;
Xu, Hongyan ;
Xu, Bingsheng .
APPLIED SURFACE SCIENCE, 2011, 257 (11) :4877-4884
[33]   Wetting behaviour and interfacial microstructure of Sn-Ag-Zn solder alloys on nickel coated aluminium substrates [J].
Satyanarayan ;
Prabhu, K. N. .
MATERIALS SCIENCE AND TECHNOLOGY, 2011, 27 (07) :1157-1162
[34]   Effect of adding 0.3wt% Ni into the Sn-0.7 wt%Cu solder - Part I: Wetting behavior on Cu and Ni substrates [J].
Rizvi, M. J. ;
Bailey, C. ;
Chan, Y. C. ;
Lu, H. .
JOURNAL OF ALLOYS AND COMPOUNDS, 2007, 438 (1-2) :116-121
[35]   Contour evolution and sliding behavior of molten Sn-Ag-Cu on tilting Cu and Al2O3 substrates [J].
Xu, Hongyan ;
Yuan, Zhangfu ;
Lee, Joonho ;
Matsuura, Hiroyuki ;
Tsukihashi, Fumitaka .
COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS, 2010, 359 (1-3) :1-5
[36]   Effect of Ti content on the wetting behavior of Sn0.3Ag0.7Cu/AlN system [J].
Fu, W. ;
Song, X. G. ;
Zhao, Y. X. ;
Cao, J. ;
Feng, J. C. ;
Jin, C. ;
Wang, G. D. .
MATERIALS & DESIGN, 2017, 115 :1-7
[37]   Reactive wetting and spreading of Al-Si-Mg alloys on Si3N4/Si substrates [J].
de la Pena, J. L. ;
Pech-Canul, M. I. .
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2008, 491 (1-2) :461-469
[38]   Wettability and Interfacial Characteristic of Sn-Ag-Cu solder on Ni Substrates at elevated temperatures [J].
Zang, Likun ;
Yuan, Zhangfu ;
Yan, Hongliang ;
Li, Xinxue .
ADVANCES IN CHEMISTRY RESEARCH II, PTS 1-3, 2012, 554-556 :703-+
[39]   Effect of Reflow Time on Wetting Behavior, Microstructure Evolution, and Joint Strength of Sn-2.5Ag-0.5Cu Solder on Bare and Nickel-Coated Copper Substrates [J].
Mrunali Sona ;
K. Narayan Prabhu .
Journal of Electronic Materials, 2016, 45 :3744-3758
[40]   Effect of Reflow Time on Wetting Behavior, Microstructure Evolution, and Joint Strength of Sn-2.5Ag-0.5Cu Solder on Bare and Nickel-Coated Copper Substrates [J].
Sona, Mrunali ;
Prabhu, K. Narayan .
JOURNAL OF ELECTRONIC MATERIALS, 2016, 45 (07) :3744-3758
12345