共 50 条
- [23] Effect of Melting Temperature on Wettability of Sn-Ag-Cu Alloys on Cu Substrate JOURNAL OF POLYTECHNIC-POLITEKNIK DERGISI, 2018, 21 (03): : 587 - 589
- [25] Spreading Dynamics and Interfacial Characteristics of Sn-3.0Ag-0.5Cu-xBi Melting on Cu Substrates Microgravity Science and Technology, 2016, 28 : 115 - 122
- [27] Alloying effects on wetting ability of diluted cu-sn melts on graphite substrates Period Polytech Transp Eng, 2013, 2 (123-126): : 123 - 126
- [28] Influence of bismuth (Bi) addition on wetting characteristics of Sn-3Ag-0.5Cu solder alloy on Cu substrate ENGINEERING SCIENCE AND TECHNOLOGY-AN INTERNATIONAL JOURNAL-JESTECH, 2018, 21 (06): : 1159 - 1163
- [30] Effect of cerium addition on wetting, undercooling, and mechanical properties of Sn-3.9Ag-0.7Cu Pb-free solder alloys Journal of Materials Science: Materials in Electronics, 2013, 24 : 3456 - 3466