Non-reactive versus dissolutive wetting of Ag–Cu alloys on Cu substrates

被引:0
|
作者
O. Kozlova
R. Voytovych
P. Protsenko
N. Eustathopoulos
机构
[1] SIMaP/PHELMA,Department of Colloid Chemistry
[2] INPG,undefined
[3] D.U.,undefined
[4] MSU,undefined
来源
Journal of Materials Science | 2010年 / 45卷
关键词
Contact Angle; Liquid Film; Spreading Rate; Triple Line; Equilibrium Contact Angle;
D O I
暂无
中图分类号
学科分类号
摘要
The fundamental issues of equilibrium and non-equilibrium (dissolutive) wetting and spreading in the liquid Ag/solid Cu system are studied by the dispensed drop technique. To this end, wetting experiments of Cu, both mono- and poly-crystalline, with two types of Ag–Cu alloys, one non-saturated and the other saturated in copper, are performed at 900 °C in high vacuum by the dispensed drop technique. The results are compared with those given in the literature for the same or similar systems as well as with model predictions.
引用
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页码:2099 / 2105
页数:6
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