Evolution of the structure upon heating of submicrocrystalline and nanocrystalline copper produced by high-rate deformation

被引：0

作者：

I. V. Khomskaya

V. I. Zel’dovich

A. E. Kheifets

N. Yu. Frolova

V. P. Dyakina

V. A. Kazantsev

机构：

[1] Russian Academy of Sciences,Institute of Metal Physics, Ural Branch

来源：

The Physics of Metals and Metallography | 2011年 / 111卷

关键词：

bulk nanomaterials; high-rate pressing; thermal stability; interrelation of structure and properties;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

Methods of electron microscopy, dilatometry, and microhardness and resistivity measurements have been used to study the effect of annealing on the process of recrystallization of a mixed submicrocrys-talline+nanocrystalline (SMC+NC) structure of 99.8% copper produced by high-rate (∼105 s−1) deformation using dynamic channel angular pressing (DCAP). It has been shown that the SMC+NC structure of copper is thermally stable upon heating to a temperature of 150°C. It has been found that the ρ/ρ0 ratio of copper with an SMC+NC structure at a temperature of 4.2 K is considerably (by 5 times) higher than ρ/ρ0 of copper in the annealed coarse-grained state. This effect is due to a high concentration of defects and a high degree of dispersity of the copper structure after DCAP. Changes in the microhardness and in the resistivity (at a temperature of 4.2 K) of the SMC+NC copper after annealing characterize the level of relaxation processes.

引用

页码：367 / 374

页数：7

共 40 条

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