Manufacturability and mechanical reliability study for heterogeneous integration system in display (HiSID)

In this paper, the system on display panel (SoDP) architecture, the primary stage of heterogeneous integration system in display (HiSID), is introduced for the first time. In this architecture, the driving components of display, which are supposed to be on the display flexible print circuit (FPC) in traditional architecture, are innovatively integrated onto the backside of display panel. Through the SoDP architecture, the simulated impact strain in the panel fan-out region can decrease about 30% compared to the traditional architecture, and SoDP provides more the 10 mm extra space in the in-plane Y-direction for holding a larger battery. Also, the SoDP is compatible with the current organic laser emitted diode (OLED) and system in package (SiP) processes. Besides the primary stage, this paper also presents a comprehensive and extensive analysis on the challenges of the manufacturability for the advanced stage of HiSID from four key technologies perspectives: device miniaturization, massive manufacturing, driving technology, and advanced heterogeneous integration.