Electroplating kinetics of a nickel-tungsten alloy

被引：0
|
作者：
V. L. Kotov
M. V. Shmukler
机构：
[1] Ivanovo State Chemical-Technological University,
来源：
Protection of Metals | 2006年 / 42卷
关键词：
Inorganic Chemistry; Field Intensity; Sorption Process; Electric Field Intensity; Alloy Formation;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Electroplating a nickel-tungsten alloy under various electrolysis conditions (direct and alternating current) is studied. A radical-film mechanism of the alloy formation by the cathodic deposition is experimentally proved. The effect of sorption processes at the film-electrolyte boundary on the alloy formation, as well as the possibility of controlling the film composition and structure by changing the electric field intensity, is studied. Deposits with a content of the high-melting component of up to 61% are obtained.
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页码：153 / 157
页数：4
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