Thermal conductivity studies on composites of poly(phenylene ether)/polyamide with hollow glass beads (HGB)

Thermally insulating polymer composites are in focus due to the growing industrial demand for sustainable and energy efficient materials. Polymers are intrinsically poor thermal conductors and this property is further enhanced by the addition of insulating fillers in the polymer matrix. Rigid hollow glass beads (HGB) containing polymeric composites are expected to have low thermal conductivities and have additional properties, such as sound proofing, light weight and improved mechanical properties. Four different types of HGB with varying crush strengths, particle size/distributions and densities were evaluated in poly(phenylene ether/polyamide (PPE/PA66) blend to further reduce the blend’s intrinsic thermal conductivity. The results showed that the reduction in thermal conductivity was dependent on density and extent of breakage of HGB during processing. Amongst all the evaluated HGB, S38XHS grade of HGB could significantly reduce the thermal conductivity of PPE/PA66 blend.