Effect of the Technological Heredity Factors on the Quality Indicators of Adhesive and Weld-Bonded Joints Performed under Various Temperature Conditions

被引：0
作者：
N. I. Baurova
A. Yu. Konoplin
机构：
[1] Moscow Automobile and Road Construction State Technical University (MADI),
来源：
Russian Metallurgy (Metally) | 2020年 / 2020卷
关键词：
adhesive joints; weld-bonded joints; gluing; technological errors; technological heredity;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
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页码：1585 / 1589
页数：4
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