Microstructure and properties of high-strength Cu–Ni–Si–(Ti) alloys

被引：0
作者：
Yi-Hai Yang
Sheng-Yao Li
Zhen-Shan Cui
Zhou Li
Yun-Ping Li
Qian Lei
机构：
[1] Central South University,State Key Lab for Powder Metallurgy
[2] Nanyang Technological University,School of Physical and Mathematical Science
[3] Central South University,School of Materials Science and Engineering
来源：
Rare Metals | 2021年 / 40卷
关键词：
Copper alloy; Microstructure; Strength; Electrical conductivity;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
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收藏
页码：3251 / 3260
页数：9
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