Effect of Purging Gas on Wetting Behavior of Sn-3.5Ag Lead-Free Solder on Nickel-Coated Aluminum Substrate

被引：0
作者：
K. N. Prabhu
M. Varun
机构：
[1] National Institute of Technology Karnataka,Department of Metallurgical & Materials Engineering
来源：
Journal of Materials Engineering and Performance | 2013年 / 22卷
关键词：
IMCs; lead-free solder; soldering atmosphere; wetting;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
The wetting characteristics of Sn-3.5Ag lead-free solder alloy on nickel-coated aluminum substrates in air (ambient), nitrogen, and argon atmospheres were investigated. The contact angles for the solder alloy obtained under air and argon atmospheres were in the range of 36°-38°. With nitrogen atmosphere the contact angle was found to be significantly lower at about 26°. Solder solidifying in air exhibited needle-shaped tin-rich dendrites surrounded by a eutectic matrix. The amount of tin dendrites decreased in argon atmosphere. However, the morphology of tin dendrites transformed from needle-shaped to nearly non-dendritic shape as the soldering atmosphere was changed from air to nitrogen. The interfacial microstructures revealed the presence of Ni3Sn and Ni3Sn4 IMCs at the interface. The enhanced wettability observed under nitrogen atmosphere is attributed to the higher thermal conductivity of nitrogen gas and the formation of higher amount of Ni3Sn IMCs at the interface compared to air and argon atmospheres.
引用
收藏
页码：723 / 728
页数：5
相关论文
共 19 条
  • [1] Suganuma K(2001)Advances in Lead-Free Electronics Soldering Curr. Opin. Solid State Mater. Sci. 5 55-64
  • [2] Abtewa JM(2000)Lead-Free Solders in Microelectronics Mater. Sci. Eng., R 27 95-141
  • [3] Selvaduray G(2010)Determination of Spread Activation Energy and Assessment of Wetting Behavior of Solders on Metallic Substrates J. Electron. Packag. 132 041001-289
  • [4] Prabhu KN(2002)Development of Lead-Free Wave Soldering Process IEEE Trans. Electron. Packag. Manuf. 25 99-64
  • [5] Kumar G(2005)The Bonding of Nanowire Assemblies Using Adhesive and Solder JOM 57 60-158
  • [6] Arra M(2008)Effect of Dissolution on the Ni Solid State Phenom. 138 153-1255
  • [7] Shangguan D(2006)Sn J. Phase Equilib. Diffus. 27 315-1162
  • [8] Sammy Y(1999) Growth Kinetics at the Interface of Ni and Liquid Sn-Base Solders J. Electron. Mater. 28 1251-undefined
  • [9] Thalhammer R(2011)Ni-Sn (Nickel-Tin) Mater. Sci. Technol. 27 1157-undefined
  • [10] Fockenberger H(undefined)Effect of Ni Layer Thickness and Soldering Time on Intermetallic Compound Formation at the Interface Between Molten Sn-3.5Ag and Ni/Cu Substrate undefined undefined undefined-undefined
12