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Investigation of the electrochemical growth of a Cu–Zn–Sn film on a molybdenum substrate using a citrate solution
被引:0
作者
:
Tubshin Hreid
论文数:
0
引用数:
0
h-index:
0
机构:
Queensland University of Technology,School of Chemistry, Physics and Mechanical Engineering, Science and Engineering Faculty
Tubshin Hreid
Anthony P. O’Mullane
论文数:
0
引用数:
0
h-index:
0
机构:
Queensland University of Technology,School of Chemistry, Physics and Mechanical Engineering, Science and Engineering Faculty
Anthony P. O’Mullane
Henry J. Spratt
论文数:
0
引用数:
0
h-index:
0
机构:
Queensland University of Technology,School of Chemistry, Physics and Mechanical Engineering, Science and Engineering Faculty
Henry J. Spratt
Geoffrey Will
论文数:
0
引用数:
0
h-index:
0
机构:
Queensland University of Technology,School of Chemistry, Physics and Mechanical Engineering, Science and Engineering Faculty
Geoffrey Will
Hongxia Wang
论文数:
0
引用数:
0
h-index:
0
机构:
Queensland University of Technology,School of Chemistry, Physics and Mechanical Engineering, Science and Engineering Faculty
Hongxia Wang
机构
:
[1]
Queensland University of Technology,School of Chemistry, Physics and Mechanical Engineering, Science and Engineering Faculty
[2]
Queensland University of Technology,Central Analytical Research Facility, Institute for Future Environments
来源
:
Journal of Applied Electrochemistry
|
2016年
/ 46卷
关键词
:
Cu–Zn–Sn film;
Electrochemical growth;
Mo substrate;
H;
evolution;
Cu;
Sn;
alloy phase;
Cu;
Zn;
alloy phase;
D O I
:
暂无
中图分类号
:
学科分类号
:
摘要
:
引用
收藏
页码:769 / 778
页数:9
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Beijing Inst Technol, Sch Mat Sci & Engn, Beijing 100081, Peoples R China
Peking Univ, Coll Engn, Beijing 100871, Peoples R China
Xia, Zhonghong
Xia, Dingguo
论文数:
0
引用数:
0
h-index:
0
机构:
Peking Univ, Coll Engn, Beijing 100871, Peoples R China
Peking Univ, Coll Engn, Beijing 100871, Peoples R China
Xia, Dingguo
ELECTROCHIMICA ACTA,
2010,
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Microstructure and mechanical strength of Cu/Sn/Cu microbump via Ni and Zn doping into Cu substrate
Huang, Pin-Wei
论文数:
0
引用数:
0
h-index:
0
机构:
Natl Tsing Hua Univ, Dept Mat Sci & Engn, Hsinchu, Taiwan
Natl Tsing Hua Univ, Dept Mat Sci & Engn, Hsinchu, Taiwan
Huang, Pin-Wei
Wu, Zih-You
论文数:
0
引用数:
0
h-index:
0
机构:
Natl Tsing Hua Univ, Dept Mat Sci & Engn, Hsinchu, Taiwan
Natl Tsing Hua Univ, Dept Mat Sci & Engn, Hsinchu, Taiwan
Wu, Zih-You
Lee, Yin-Ku
论文数:
0
引用数:
0
h-index:
0
机构:
Natl Tsing Hua Univ, Dept Mat Sci & Engn, Hsinchu, Taiwan
Natl Tsing Hua Univ, Dept Mat Sci & Engn, Hsinchu, Taiwan
Lee, Yin-Ku
Chao, Chen-Sung
论文数:
0
引用数:
0
h-index:
0
机构:
Natl Tsing Hua Univ, Dept Mat Sci & Engn, Hsinchu, Taiwan
Natl Tsing Hua Univ, Dept Mat Sci & Engn, Hsinchu, Taiwan
Chao, Chen-Sung
Tsai, Su-Yueh
论文数:
0
引用数:
0
h-index:
0
机构:
Natl Tsing Hua Univ, Precis Instrument Ctr, Hsinchu, Taiwan
Natl Tsing Hua Univ, Dept Mat Sci & Engn, Hsinchu, Taiwan
Tsai, Su-Yueh
Chang, Shou-Yi
论文数:
0
引用数:
0
h-index:
0
机构:
Natl Tsing Hua Univ, Dept Mat Sci & Engn, Hsinchu, Taiwan
Natl Tsing Hua Univ, Dept Mat Sci & Engn, Hsinchu, Taiwan
Chang, Shou-Yi
Duh, Jenq-Gong
论文数:
0
引用数:
0
h-index:
0
机构:
Natl Tsing Hua Univ, Dept Mat Sci & Engn, Hsinchu, Taiwan
101 Sec 2,Kuang Fu Rd, Hsinchu 30013, Taiwan
Natl Tsing Hua Univ, Dept Mat Sci & Engn, Hsinchu, Taiwan
Duh, Jenq-Gong
MATERIALS CHEMISTRY AND PHYSICS,
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X-ray photoemission investigation of the corrosion film formed on a polished Cu-13Sn alloy in aerated NaCl solution
Debiemme-Chouvy, C
论文数:
0
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0
h-index:
0
机构:
Univ Versailles, Inst Lavoisier, IREM, UMR CNRS C8637, F-78000 Versailles, France
Univ Versailles, Inst Lavoisier, IREM, UMR CNRS C8637, F-78000 Versailles, France
Debiemme-Chouvy, C
Ammeloot, F
论文数:
0
引用数:
0
h-index:
0
机构:
Univ Versailles, Inst Lavoisier, IREM, UMR CNRS C8637, F-78000 Versailles, France
Univ Versailles, Inst Lavoisier, IREM, UMR CNRS C8637, F-78000 Versailles, France
Ammeloot, F
Sutter, EMM
论文数:
0
引用数:
0
h-index:
0
机构:
Univ Versailles, Inst Lavoisier, IREM, UMR CNRS C8637, F-78000 Versailles, France
Univ Versailles, Inst Lavoisier, IREM, UMR CNRS C8637, F-78000 Versailles, France
Sutter, EMM
APPLIED SURFACE SCIENCE,
2001,
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Electrochemical migration and rapid whisker growth of Zn and Bi dopings in Sn-3.0Ag-0.5Cu solder in 3wt.% NaCl solution
Hua, L.
论文数:
0
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0
h-index:
0
机构:
Hubei Univ Educ, Sch Chem & Life Sci, Wuhan 430205, Peoples R China
Hubei Univ Educ, Sch Chem & Life Sci, Wuhan 430205, Peoples R China
Hua, L.
Su, M. W.
论文数:
0
引用数:
0
h-index:
0
机构:
Hubei Univ Educ, Sch Chem & Life Sci, Wuhan 430205, Peoples R China
Hubei Univ Educ, Sch Chem & Life Sci, Wuhan 430205, Peoples R China
Su, M. W.
Zhang, W. J.
论文数:
0
引用数:
0
h-index:
0
机构:
Hubei Univ Educ, Sch Chem & Life Sci, Wuhan 430205, Peoples R China
Hubei Univ Educ, Sch Chem & Life Sci, Wuhan 430205, Peoples R China
Zhang, W. J.
Hu, Q. L.
论文数:
0
引用数:
0
h-index:
0
机构:
Hubei Univ Educ, Sch Chem & Life Sci, Wuhan 430205, Peoples R China
Hubei Univ Educ, Sch Chem & Life Sci, Wuhan 430205, Peoples R China
Hu, Q. L.
ADVANCED MATERIALS, PTS 1-4,
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Diffusion growth of Cu3Sn phase in the bump and thin film Cu/Sn structures
Dimcic, B.
论文数:
0
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0
h-index:
0
机构:
IMEC, Interuniv Microelect Ctr, B-3001 Louvain, Belgium
KULeuven, Dept Mat Engn, B-3001 Louvain, Belgium
IMEC, Interuniv Microelect Ctr, B-3001 Louvain, Belgium
Dimcic, B.
Labie, R.
论文数:
0
引用数:
0
h-index:
0
机构:
IMEC, Interuniv Microelect Ctr, B-3001 Louvain, Belgium
IMEC, Interuniv Microelect Ctr, B-3001 Louvain, Belgium
Labie, R.
De Messemaeker, J.
论文数:
0
引用数:
0
h-index:
0
机构:
IMEC, Interuniv Microelect Ctr, B-3001 Louvain, Belgium
IMEC, Interuniv Microelect Ctr, B-3001 Louvain, Belgium
De Messemaeker, J.
Vanstreels, K.
论文数:
0
引用数:
0
h-index:
0
机构:
IMEC, Interuniv Microelect Ctr, B-3001 Louvain, Belgium
IMEC, Interuniv Microelect Ctr, B-3001 Louvain, Belgium
Vanstreels, K.
Croes, K.
论文数:
0
引用数:
0
h-index:
0
机构:
IMEC, Interuniv Microelect Ctr, B-3001 Louvain, Belgium
IMEC, Interuniv Microelect Ctr, B-3001 Louvain, Belgium
Croes, K.
Verlinden, B.
论文数:
0
引用数:
0
h-index:
0
机构:
KULeuven, Dept Mat Engn, B-3001 Louvain, Belgium
IMEC, Interuniv Microelect Ctr, B-3001 Louvain, Belgium
Verlinden, B.
De Wolf, I.
论文数:
0
引用数:
0
h-index:
0
机构:
IMEC, Interuniv Microelect Ctr, B-3001 Louvain, Belgium
KULeuven, Dept Mat Engn, B-3001 Louvain, Belgium
IMEC, Interuniv Microelect Ctr, B-3001 Louvain, Belgium
De Wolf, I.
MICROELECTRONICS RELIABILITY,
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Diffusion Behavior of Zn During Reflow of Sn-9Zn Solder on Ni/Cu Substrate
Mittal, Jagjiwan
论文数:
0
引用数:
0
h-index:
0
机构:
Natl Cheng Kung Univ, Dept Mat Sci & Engn, Tainan 70101, Taiwan
Natl Cheng Kung Univ, Dept Mat Sci & Engn, Tainan 70101, Taiwan
Mittal, Jagjiwan
Kuo, Shih-Ming
论文数:
0
引用数:
0
h-index:
0
机构:
Natl Cheng Kung Univ, Dept Mat Sci & Engn, Tainan 70101, Taiwan
Natl Cheng Kung Univ, Dept Mat Sci & Engn, Tainan 70101, Taiwan
Kuo, Shih-Ming
Lin, Yu-Wei
论文数:
0
引用数:
0
h-index:
0
机构:
Natl Cheng Kung Univ, Dept Mat Sci & Engn, Tainan 70101, Taiwan
Natl Cheng Kung Univ, Dept Mat Sci & Engn, Tainan 70101, Taiwan
Lin, Yu-Wei
论文数:
引用数:
h-index:
机构:
Lin, Kwang-Lung
JOURNAL OF ELECTRONIC MATERIALS,
2009,
38
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Interfacial characteristics and microstructural evolution of Sn-6.5Zn solder/Cu substrate joints during aging
Zhao Guo-ji
论文数:
0
引用数:
0
h-index:
0
机构:
Chongqing Univ, Coll Mat Sci & Engn, Chongqing 400044, Peoples R China
Chongqing Univ, Coll Mat Sci & Engn, Chongqing 400044, Peoples R China
Zhao Guo-ji
Sheng Guang-min
论文数:
0
引用数:
0
h-index:
0
机构:
Chongqing Univ, Coll Mat Sci & Engn, Chongqing 400044, Peoples R China
Chongqing Univ, Coll Mat Sci & Engn, Chongqing 400044, Peoples R China
Sheng Guang-min
Wu Li-li
论文数:
0
引用数:
0
h-index:
0
机构:
Chongqing Univ, Coll Mat Sci & Engn, Chongqing 400044, Peoples R China
Chongqing Univ, Coll Mat Sci & Engn, Chongqing 400044, Peoples R China
Wu Li-li
Yuan Xin-jian
论文数:
0
引用数:
0
h-index:
0
机构:
Chongqing Univ, Coll Mat Sci & Engn, Chongqing 400044, Peoples R China
Chongqing Univ, Coll Mat Sci & Engn, Chongqing 400044, Peoples R China
Yuan Xin-jian
TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA,
2012,
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1960
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