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- [3] Interfacial growth behavior of Sn-9Zn/additive Cu-particles and Sn-9Zn/Cu-substrate Zhongguo Youse Jinshu Xuebao, 2007, 7 (1083-1089):
- [7] Die-Bonding of LED Chips on Ag/Cu Substrate Using Sn/Zn/Bi/Sn and Sn/Bi/Zn/Bi/Sn Bonding Systems Journal of Electronic Materials, 2018, 47 : 77 - 83