Dielectric properties and their dependence of polyetherimide/bismaleimide blends for high performance copper clad laminates

Developing high performance matrix for High Performance Copper Clad Laminates (HPCCLs) has been a fascinating focus in the micro-electric industry since the beginning of this century. This article presents the first report on investigating the dielectric properties of a blend system (PEI/BD) based on polyetherimide (PEI) and o,o′-diallyl bisphenol A (DBA) modified 4,4′-bismaleimidodiphenyl methane (BDM), and discussing the dependence of dielectric properties on morphology, frequency and absorbed water. Results show that the morphology of the blend changes from a dispersed phase to completely co-continuous phase and perfect phase inversion, successively, as the content of PEI in the blend is increased. The dielectric properties of the PEI/BD system are not only frequency-dependent, but also morphology-dependent and moisture-dependent. The very good water resistance and extremely stable dielectric properties suggest that PEI/BD blends have great potential to be the matrices for fabricating HPCCLs and other advanced composites.