Suppressing Growth of the Cu5Zn8 Intermetallic Layer in Sn-Zn-Ag-Al-Ga/Cu Solder Joints

被引：0

作者：

R. S. Lai

K. L. Lin

B. Salam

机构：

[1] National Cheng-Kung University,Department of Materials Science and Engineering, Frontier Material and Micro/Nano Science and Technology Center

来源：

Journal of Electronic Materials | 2009年 / 38卷

关键词：

Intermetallic compound; lead-free solder; Sn-Zn alloy;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

Cu5Zn8 normally forms between Sn-Zn solder and Cu metallization. In this study, the growth of the intermetallic compound (IMC) layer is slowed by increasing the silver content in the Sn-8.5Zn-Ag-Al-Ga/Cu system. Experimental results showed that the total thickness of the IMC layers formed with 1.5 wt.% silver content was about half that without silver. The reduction might be due to the formation of the intermetallic compound (Ag,Cu)-Zn at the interface in addition to silver.

引用

页码：88 / 92

页数：4

共 16 条

[1]

Liu N.S.(2006)undefined Scr. Mater. 54 219-undefined

[2]

Lin K.L.(2005)undefined Proc. Electron Comp. Tech. Conf. 1 692-undefined

[3]

Lin K.L.(2006)undefined J. Alloy Comp. 416 98-undefined

[4]

Chiu Y.T.(2004)undefined J. Electron. Mater. 33 321-undefined

[5]

Chen K.I.(1993)undefined Int. J. Microcirc. Electron. Pack. 16 363-undefined

[6]

Cheng S.C.(undefined)undefined undefined undefined undefined-undefined

[7]

Wu S.(undefined)undefined undefined undefined undefined-undefined

[8]

Lin K.L.(undefined)undefined undefined undefined undefined-undefined

[9]

Kariya Y.(undefined)undefined undefined undefined undefined-undefined

[10]

Hosoi T.(undefined)undefined undefined undefined undefined-undefined

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