Acetic acid mediated leaching of metals from lead-free solders

Background: The replacement of lead (Pb)-bearing solders by several Pb-free solders is a subject of intense research in these days due to the toxic effects of Pb on the environment. However, the Pb-free solders contain metals such as silver (Ag), copper (Cu), and zinc (Zn). The increasing use of these Pb-free solders again increases the risk of release of Ag, Cu, and Zn metals into the environment. The Pb-free solders can, therefore, be used as a secondary source for the metals which will not only help in environmental protection but also for the resource recovery. Results: This study reports a process to leach metals from hazardous soldering materials by acetic acid. Acetic acid was found more effective for metal recovery from the tin–copper (Sn–Cu) solder than tin–copper–silver (Sn–Cu–Ag) solder. Various process parameters were optimized for recovery of metals from Sn–Cu solder. It required 30 h for 100% recovery of Cu and Sn, respectively. The metal recovery increased gradually with an increase in acid concentration approaching complete recovery at an acid concentration of 80%. Effect of shaking speed and temperature on the recovery of metals from Sn–Cu solder was studied. The metal recovery decreased with an increase in solder weight. Conclusion: The present study reveals an effective process to recycle the Pb-free solders. The low concentration of acetic acid was also found significant for metal leaching from solder. The research provides basic knowledge for recovery of metals from Pb-free solders.[Figure not available: see fulltext.]. © 2017, The Author(s).