Thermodynamic analysis and characterization of Bi–Cu–Sn alloys as advanced lead-free solder materials for high temperature application

Due to the frequent use of Cu as a substrate material in electronics, it is important to understand the interactions between the solders and the substrates, based on the knowledge of the phase equilibria, thermodynamics and other characteristics of the Bi–Cu–Sn system. The results of thermodynamic analysis and characterization of Bi–Cu–Sn alloys as advanced lead-free solder materials for high temperature application are presented in this paper. The research includes analytical investigations done by thermodynamic predicting according to general solution model in temperature range 1,073–1,273 K and experimental investigations performed by differential thermal analysis, differential scanning calorimetry, optical microscopy, hardness and electroconductivity measurements for the sections with molar ratio Bi:Cu = 1:1, 1:3 and 3:1.