Effect of Reaction Products on the Kinetics of Copper Dipivaloylmethanate Reduction to Copper

The effects of 2,2-dimethyl-1-propanol, acetone, carbon monoxide, and water vapors on the kinetics and mechanism of copper deposition from Cu(dpm)2 vapor are studied in the range 200–350°C. The results demonstrate that 2,2-dimethyl-1-propanol has no effect of the deposition process, while acetone inhibits Cu deposition and impairs the quality of the resulting film. Carbon monoxide reduces the deposition rate and raises the activation energy of the process to 46 ± 8 kJ/mol. The introduction of water vapor accelerates film growth and reduces the activation energy to 10 ± 7 kJ/mol.