Carbon nano-onions as a nanofiller for enhancing thermal conductivity of epoxy composites

被引:0
作者
Xianzhe Wei
Guoqiang Yin
Xiangyang Zhou
Linhong Li
Maohua Li
Yue Qin
Xiao Hou
Guichen Song
Zulfiqar Ali
Wen Dai
Su Zhao
Xingzhong Fang
Cheng-Te Lin
Nan Jiang
Jinhong Yu
机构
[1] Zhongkai University of Agriculture and Engineering,Department of Chemistry and Chemical Engineering
[2] Chinese Academy of Sciences,Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering (NIMTE)
[3] University of Chinese Academy of Sciences,Center of Materials Science and Optoelectronics Engineering
[4] Zhejiang Key Laboratory of Aero Engine Extreme Manufacturing Technology,Key Laboratory of Additive Manufacturing Materials of Zhejiang Province, Ningbo Institute of Materials Technology and Engineering
[5] Chinese Academy of Sciences,undefined
来源
Applied Nanoscience | 2023年 / 13卷
关键词
Carbon nano-onions; Epoxy; Thermal conductivity;
D O I
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中图分类号
学科分类号
摘要
Carbon nano-onions (CNOs) are a relatively new member in zero-dimensional carbon nanomaterials. Each constituent unit of CNOs is a multi-layer concentric spherical structure composed of multiple fullerene-like carbon spheres. CNOs are widely used for electronic components applications due to their large specific surface area and high electric conductivity. But a few works of CNOs on thermal conduction property in electronic device applications were studied. Therefore, we prepared the CNOs/epoxy composites by blending and casting method, and investigated the thermal conduction mechanism of CNOs in the epoxy matrix. The results show that the thermal conductivity of epoxy composite with 30 wt% CNOs loading reaches 0.59 W m−1 K−1 due to the formation of an effective thermal network of CNOs in epoxy resin, increasing by 320% in comparison with neat epoxy. In view of excellent thermal conduction performance, CNOs may be enable used as thermal conductive filler for the thermal management of electronic components.
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页码:483 / 491
页数:8
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