Study into grinding force in back grinding of wafer with outer rim

被引：0
作者：
Xiang-Long Zhu
Yu Li
Zhi-Gang Dong
Ren-Ke Kang
Shang Gao
机构：
[1] Dalian University of Technology,Key Laboratory for Precision and Non
来源：
Advances in Manufacturing | 2020年 / 8卷
关键词：
Silicon wafer; Back grinding of wafer with outer rim (BGWOR); Grinding force; Grinding mark density;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Back grinding of wafer with outer rim (BGWOR) is a new method for carrier-less thinning of silicon wafers. At present, the effects of process parameters on the grinding force remain debatable. Therefore, a BGWOR normal grinding force model based on grain depth-of-cut was established, and the relationship between grinding parameters (wheel infeed rate, wheel rotational speed, and chuck rotational speed) and normal grinding force was discussed. Further, a series of experiments were performed to verify the BGWOR normal grinding force model. This study proves that the BGWOR normal grinding force is related to the rotational direction of the wheel and chuck, and the effect of grinding mark density on the BGWOR normal grinding force cannot be ignored. Moreover, this study provides methods for reducing the grinding force and optimizing the back thinning process of the silicon wafer.
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页码：361 / 368
页数：7
相关论文
共 56 条
  • [1] Zhang YX(2006)Raman microspectroscopy study on the ground surface of monocrystalline silicon wafers Key Eng Mater 304/305 241-245
  • [2] Kang RK(2016)A load identification method for the grinding damage induced stress (GDIS) distribution in silicon wafers Int J Mach Tools Manuf 107 1-7
  • [3] Guo DM(2010)Study on the subsurface damage distribution of the silicon wafer ground by diamond wheel Adv Mater Res 126/128 113-118
  • [4] Zhou P(2017)Influence of Si wafer thinning processes on (sub)surface defects Appl Surf Sci 404 82-87
  • [5] Xu S(2016)A predictive model of grinding force in silicon wafer self-rotating grinding Int J Mach Tools Manuf 109 74-86
  • [6] Wang Z(2002)Fine grinding of silicon wafers: designed experiments Int J Mach Tools Manuf 42 395-404
  • [7] Gao S(2008)Experimental investigation on subsurface damage depth of ground silicon wafers in wafer-rotating grinding Diam Abras Eng 4 3-7
  • [8] Kang RK(2007)Novel method to investigate the critical depth of cut of ground silicon wafer J Mater Process Technol 182 157-162
  • [9] Guo DM(2018)Analytical elastic-plastic cutting model for predicting grain depth-of-cut in ultrafine grinding of silicon wafer J Manuf Sci Eng Trans ASME 140 1-7
  • [10] Inoue F(2016)Model of grain depth of cut in wafer rotation grinding method for silicon wafers J Mech Eng 52 86-93
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