Shear strength of copper joints prepared by low temperature sintering of silver nanoparticles

被引:0
作者
Zbyněk Pešina
Vít Vykoukal
Marián Palcut
Jiří Sopoušek
机构
[1] Brno University of Technology,Central European Institute of Technology (CEITEC BUT), Faculty of Mechanical Engineering
[2] Masaryk University,Institute of Chemistry, Faculty of Sciences
[3] Slovak University of Technology in Bratislava,Faculty of Materials Science and Technology in Trnava
[4] Masaryk University,Central European Institute of Technology (CEITEC MU)
来源
Electronic Materials Letters | 2014年 / 10卷
关键词
Ag nanoparticles; shear strength; low-temperature sintering; lead-free solder;
D O I
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摘要
In this work, mechanical properties of Cu-to-Cu joint samples prepared by low temperature sintering of Ag nanoparticle paste have been investigated. The silver nanopaste was prepared by a controlled thermal decomposition of an organometallic precursor. The as-synthesized Ag particles were spherical, with an average diameter of 8.5 nm. The Cu-to-Cu joint samples were made by placing a small amount of Ag nanopaste between two polished Cu plates and sintering at 150°C, 200°C, 220°C and 350°C in air. A normal load was applied to aid sintering. Mechanical properties were measured by imposing a uniform stress across the sample bond area and measuring the corresponding strain. The application of external load was found to have a positive effect on the material’s mechanical properties. Furthermore, interestingly high values of shear strength were observed.
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页码:293 / 298
页数:5
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