Oxidation behavior of copper nitride thin films deposited by direct current magnetron sputtering

被引:0
|
作者
Perumal Devaraj
Pazhanisami Peranantham
Yekkoni Lakshmanan Jeyachandran
机构
[1] Bharathiar University,Department of Physics
关键词
D O I
暂无
中图分类号
学科分类号
摘要
The oxidation characteristics of copper nitride (CuxN) thin films deposited by dc magnetron sputtering in optimized sputtering conditions at room temperature and different substrate temperatures and those annealed at various temperatures under vacuum, nitrogen, oxygen and air atmospheres, and on exposure to laser radiation were investigated. Optical transmittance spectroscopy, sheet resistance measurements performed in in-vacuo and ex-vacuo conditions, Raman spectroscopy, and x-ray diffraction measurements were used to monitor the oxidation and also the decomposition characteristics of the films. The films exhibited high susceptibility to oxidation in the presence of oxygen even in residual level, large humidity effect on oxidation, and ambient dependent decomposition behavior. The oxidation pattern of the films was found to be defined by their initial composition. The oxidation of CuxN composition starts from Cu2O phase and progresses to CuO phase, whereas the Cu-rich composition stabilizes in Cu2O phase. The present study establishes the ambient and substrate / annealing temperature-dependent oxidation and decomposition behavior of the CuxN films and demonstrates the possibility of controlling their extent by adjusting these deposition and post-deposition parameters. These findings are important for fundamental understanding and relevant for resistive switching, optical storage, and photo-catalysis applications of the CuxN films.
引用
收藏
页码:27899 / 27912
页数:13
相关论文
共 50 条
  • [1] Oxidation behavior of copper nitride thin films deposited by direct current magnetron sputtering
    Devaraj, Perumal
    Peranantham, Pazhanisami
    Jeyachandran, Yekkoni Lakshmanan
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 32 (23) : 27899 - 27912
  • [2] The effect of hydrogen on copper nitride thin films deposited by magnetron sputtering
    Zhang, Guangan
    Yan, Pengxun
    Wu, Zhiguo
    Wang, Jun
    Chen, Jiangtao
    APPLIED SURFACE SCIENCE, 2008, 254 (16) : 5012 - 5015
  • [3] Comparison of chromium nitride thin films deposited by reactive direct current magnetron sputtering and high power pulsed magnetron sputtering
    Li, Qian
    Li, Hua
    Wang, Zheng-Duo
    Zhang, Hai-Bao
    Yang, Li-Zhen
    Liu, Zhong-Wei
    Chen, Qiang
    Surface Technology, 2019, 48 (09): : 64 - 69
  • [4] Residual stresses in titanium nitride thin films deposited by direct current and pulsed direct current unbalanced magnetron sputtering
    Benegra, M
    Lamas, DG
    de Rapp, MEF
    Mingolo, N
    Kunrath, AO
    Souza, RM
    THIN SOLID FILMS, 2006, 494 (1-2) : 146 - 150
  • [5] Microstructure and hydrogen impermeability of titanium nitride thin films deposited by direct current reactive magnetron sputtering
    Zhou, Tong
    Liu, Dawei
    Zhang, Ying
    Ouyang, Taoyuan
    Suo, Jinping
    JOURNAL OF ALLOYS AND COMPOUNDS, 2016, 688 : 44 - 50
  • [6] Copper nitride films deposited by dc reactive magnetron sputtering
    K. Venkata Subba Reddy
    A. Sivasankar Reddy
    P. Sreedhara Reddy
    S. Uthanna
    Journal of Materials Science: Materials in Electronics, 2007, 18 : 1003 - 1008
  • [7] Copper nitride films deposited by dc reactive magnetron sputtering
    Reddy, K. Venkata Subba
    Reddy, A. Sivasankar
    Reddy, P. Sreedhara
    Uthanna, S.
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2007, 18 (10) : 1003 - 1008
  • [8] The properties of TiN thin films deposited by pulsed direct current magnetron sputtering
    Yeh, Tung-Sheng
    Wu, Jenn-Ming
    Hu, Long-Jang
    THIN SOLID FILMS, 2008, 516 (21) : 7294 - 7298
  • [9] Oxide phase and conductivity-type of copper oxide thin films deposited by direct current magnetron sputtering
    Devaraj, Perumal
    Peranantham, Pazhanisami
    Jeyachandran, Yekkoni Lakshmanan
    PHYSICA B-CONDENSED MATTER, 2024, 691
  • [10] Study on microstructural, chemical and electrical properties of tantalum nitride thin films deposited by reactive direct current magnetron sputtering
    Michaela Grosser
    M. Münch
    J. Brenner
    M. Wilke
    H. Seidel
    C. Bienert
    A. Roosen
    U. Schmid
    Microsystem Technologies, 2010, 16 : 825 - 836