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Creep behavior of eutectic Sn-Cu lead-free solder alloy
被引：0
作者：
C. M. L. Wu
M. L. Huang
机构：
[1] City University of Hong Kong,Department of Physics and Materials Science
[2] Dalian University of Technology,Department of Materials Engineering
来源：
Journal of Electronic Materials
|
2002年
/
31卷
关键词：
Creep;
eutectic Sn-Cu;
lead-free solder alloy;
precipitation strengthening;
activation energy;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Due to a typographical error incorporated during the editing process, the following is a correction of that error.
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页码：828 / 828
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